※Advanced technologies for packaging, flex & rigid-flex§ conference Circuitree Live will predict trend in development of flex board in next five years and introduce application of new materials for flex board as well as the development of packaging technologies.
Topics cover:
Five-year Projection of the Global Flexible Circuit Market
Certification Process for Flex and Rigid-Flex PCBS
Pre-treatment and PTH Solutions for Flex-Rigid PCBS
Evaluating New FR4 Laminates for Reliability in
Rigid-Flex and Substrates
Flex board, rigid-flex board and packaging technologies
Who should attend?
PCB technology engineer, designer, technologist of
project managing, user
Staff in University (PCB, packaging, electric engineering, assemblage)?
Relevant persons of flex board, rigid- Flex board, packaging and designer
The experts and speaker attending the conference ? Bob Neves-Microtek lab ? Crystal Vanderpan 每 UL Lab ? Tafadzwa Magaya- Atotech ? Happy Holden-Asian Pacific Materials ? Dennis Yee, Rikiya Shimizu-Rohm and Haas ? Takuya Yamamoto, John Andresakis, Naomitsu Inoue, Maayuki Misawa-Oak Mitsui
If you attend the conference, you will get the following things free: Conference manual﹛﹛
T-shirt﹛﹛ CD﹛﹛Lunch﹛﹛Snack
? Registration methods
Please download registration form from www.ying-zhan.com or www.tbalive.com or ask from sponsors.
Meanwhile, please transfer the registration fee into sponsors＊ bank account and send the registration form, the copy of bank remittance invoice to sponsors by fax. (Fax No: +86-21-54904537) .
Sponsors will send out confirmation after receiving complete application document and remittances.
How to registration:
Registraton fee:CPCA member USD81 /RMB 650 NON-member USD99/RMB 800? 10% off of Early Bird before 29th Sep. RMB50 off of Grouop. (over 4) The price includes a CD, a hard copy and luncheon. Sponsor contact means:
Shanghai YingZhan Business Service Co., LTD.
Unit D, 23/F, Hui-jia Building, No, 41, CaoXi Road (North) Shanghai 200030, China
Tel: +86-21-54901782,54904394,54901915
Fax: +86-21-54904537
E-mail: yinzhanc@online.sh.cn
Ctc: Ms. Jane Liu/Ms. Flora Shao
Conference Schedule - China Conference Schedule
8:00 am - 9:00 am
Registration/Continental Breakfast
9:00 am - 9:15 am
Bob Neves, Microtek Labs, Conference Overview
9:15 am - 10:00 am
Five-Year Projection of the Global Flexible Circuit Market
Robert Turunen, Dominique Numakura and James J. Hickman Presented by Bob Neves
An intensive investigation into the future of the flex industry to 2010 has been conducted. This market research estimates the global market size of all kinds of flexible and rigid-flex circuits in the next five years. Conventional and advanced flex circuits are studied individually and reported on separately.
10:00 am - 10:45 am
Certification Process for Flex and Rigid-Flex PCBs
Crystal Vanderpan 每 Underwriters Laboratories
An overview of the material, process, and certification parameters to consider when moving to a flexible or rigid-flex PCB, providing guidance for accelerating the UL certification process.
10:45 am - 11:00 am
BREAK
11:00 am - 11:45 am
Pre-Treatment and PTH Solutions for Flex-Rigid PCBs
Tafadzwa Magaya- Atotech
A discussion of some of the difficulties faced by flex and flex-rigid PCB manufacturers such as desmearing different lay-ups of flex-rigid and electroless copper pre-treatment concepts. The authors present a production method showing benefits and results for even the most demanding of board layouts and materials.
12:00 pm - 1:00 pm
LUNCH
1:00 pm - 1:45 pm
Evaluating New FR4 Laminates for Reliability in Rigid-Flex and Substrates
Happy Holden 每 Asian Pacific Materials
An investigation of the reliability of the newer higher-temperature resistant FR-4s used for a 0.034§ eight (8)每layer, all FR-4 rigid-flex subjected to lead-free, RoHS compliant assembly temperatures and rework.
1:45 pm - 2:30 pm
Metallization of Packaging Substrates: MHC Beyond the Rigid PCB
Dennis Yee, Rikiya Shimizu 每 Rohm and Haas
The required characteristics of semiconductor package design with adhesion promotion and electroless copper deposition processes.
